time：2017-07-30 15:42:00 browse：4164次
Our research and development "to the semiconductor refrigeration piece support package LED" technology has been through the national invention patent (Patent No.: 201210243590), the technology of the LED chip package to support the semiconductor refrigeration piece structure, no other thermal components between the LED chip and the bracket has the advantages of compact structure, light weight, low manufacturing cost. Can improve the enthusiasm and efficiency of refrigeration and utilization, achieve the best cooling effect, cooling and heat dissipation of the LED chip through the electric refrigeration and heat exchange form, can effectively ensure the LED chip at a low temperature, avoid excessive junction temperature, reduce the light, prolong the lifetime of LED.
